Thin Film Technology I

5 credits

Syllabus, Master's level, 1TE016

A revised version of the syllabus is available.
Code
1TE016
Education cycle
Second cycle
Main field(s) of study and in-depth level
Chemistry A1F, Materials Engineering A1F, Physics A1F, Technology A1F
Grading system
Pass with distinction, Pass with credit, Pass, Fail
Finalised by
The Faculty Board of Science and Technology, 18 April 2016
Responsible department
Department of Materials Science and Engineering

Entry requirements

130 credits in science/engineering. Materials Analysis should have been attended.

Learning outcomes

After a successfully completed course the students will be able to:

  • discuss the differences and similarities between different vacuum based deposition techniques,
  • evaluate and use models for nucleating and growth of thin films,
  • asses the relation between deposition technique, film structure, and film properties,
  • discuss typical thin film applications,
  • motivate selection of deposition techniques for various applications.

Content

Deposition by various PVD techniques such as evaporation, sputtering, ion-plating as well as chemical coating methods (CVD and ALD). Plasma technologies for thin films. Fundamental physical and chemical processes. Effect of the substrate on the film growth and techniques for surface modification. Models for nucleation and film growth. Morphology and texture and their impact on material properties. Applications of thin film materials and deposition technologies.

Instruction

Lectures, seminars and demonstrations.

Assessment

Written examination (4 credits). Laboratory demonstrations (1 credit).

FOLLOW UPPSALA UNIVERSITY ON

facebook
instagram
twitter
youtube
linkedin