Sören Berg
Professor emer. at Department of Electrical Engineering; Solid-State Electronics
- Telephone:
- +46 18 471 31 64
- E-mail:
- soren.berg@angstrom.uu.se
- Visiting address:
- Ångströmlaboratoriet, Lägerhyddsvägen 1
75237 UPPSALA - Postal address:
- Box 65
751 03 UPPSALA
Publications
Recent publications
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A simple model for non-saturated reactive sputtering processes
Part of Thin Solid Films, 2019
- DOI for A simple model for non-saturated reactive sputtering processes
- Download full text (pdf) of A simple model for non-saturated reactive sputtering processes
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Applying "the upgraded Berg model" to predict hysteresis free reactive sputtering
p. 34-38, 2016
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Applying "the upgraded Berg model" to predict hysteresis free reactive sputtering
Part of Surface & Coatings Technology, p. 39-43, 2015
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Hysteresis-free high rate reactive sputtering of niobium oxide, tantalumoxide, and aluminum oxide
Part of Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, 2014
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Upgrading the “Berg-model” for reactive sputtering processes
Part of Thin Solid Films, p. 186-192, 2014
All publications
Articles in journal
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A simple model for non-saturated reactive sputtering processes
Part of Thin Solid Films, 2019
- DOI for A simple model for non-saturated reactive sputtering processes
- Download full text (pdf) of A simple model for non-saturated reactive sputtering processes
-
Applying "the upgraded Berg model" to predict hysteresis free reactive sputtering
Part of Surface & Coatings Technology, p. 39-43, 2015
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Hysteresis-free high rate reactive sputtering of niobium oxide, tantalumoxide, and aluminum oxide
Part of Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, 2014
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A study of the process pressure influence in reactive sputtering aiming at hysteresis elimination
Part of Surface & Coatings Technology, p. 357-361, 2013
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Modelling of sputtering yield amplification in serial reactive magnetron co-sputtering
Part of Surface & Coatings Technology, p. 5055-5059, 2012
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Studies of hysteresis effect in reactive HiPIMS deposition of oxides
Part of Surface & Coatings Technology, 2011
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Part of Journal of Physics D, p. 345501, 2011
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Reactive sputtering of SiO2–TiO2 thin film from composite Six/TiO2 targets
Part of Vacuum, p. 317-321, 2010
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Modelling of low energy ion sputtering from oxide surfaces
Part of Journal of Physics D, p. 205204, 2010
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Modelling of sputtering yield amplification effect in reactive deposition of oxides
Part of Surface & Coatings Technology, p. 3882-3886, 2010
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Influence of the target composition on reactively sputtered titanium oxide films
Part of Vacuum, p. 1295-1298, 2009
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Part of Journal of Applied Physics, 2009
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A model of DC reactive magnetron sputtering for graded solar thermal absorbers
Part of Journal of Physics, Conference Series, 2008
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High rate reactive magnetron sputter deposition of titanium oxide
Part of Applied Physics Letters, p. 221501, 2008
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Experiments and modeling of dual reactive magnetron sputtering using two reactive gases
Part of Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, p. 565-570, 2008
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The Effect of Target Aging on the Structure Formation of Zinc Oxide During Reactive Sputtering
Part of Thin Solid Films, p. 3554-3558, 2007
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Modelling of Magnetron Sputtering of Tungsten Oxide with Reactive Gas Pulsing
Part of Plasma Processes and Polymers, 2007
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Part of Appl Phys Lett, 2006
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Dynamic behaviour of the reactive sputtering process
Part of Thin Solid Films, p. 421-424, 2006
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Fundamental understanding and modeling of reactive sputtering process
Part of Thin Solid Films, p. 215-230, 2005
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Eliminating the hysteresis effect for reactive sputtering processes
Part of Appl Phys Lett, 2005
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Part of J Appl Phys, p. 3596-3604, 2003
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Experimental and computer simulation studies of the
Part of J Vac Sci Technol, p. 1981-1987, 2003
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Part of J Vac Sci Technol, p. 2664-2669, 2001
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Frequency response in pulsed DC reactive sputtering processes
Part of Thin Solid Films, p. 43-48, 2000
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Synthesis of highly oriented piezoelectric AlN films by reactive sputter deposition
Part of J. Vac. Sci. Technol. A, p. 1609-1612, 2000
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Dynamic simulations of pulsed reactive sputtering processes
Part of J Vac Sci Technol, p. 503-508, 2000
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Target compound layer formation during reactive sputtering
Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 1827-1831, 1999
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Ion assisted deposition of Zn-Mg coatings by unbalanced magnetron sputtering
Part of Surface and Coatings Technology, p. 751-754, 1999
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Preferential sputtering effects in thin film processing
Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 1916-1925, 1999
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Part of THIN SOLID FILMS, p. 227-232, 1999
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Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 1277-1285, 1998
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Composition control by current modulation in dc-reactive sputtering
Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 1868-1872, 1998
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Part of J Vac Sci Technol A, p. 1286-1292, 1998
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Angular dependence of the polysilicon etch rate during dry etching in SF6 and Cl-2
Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 686-691, 1997
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Studies of reactive sputtering of multi-phase chromium nitride
Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 248-252, 1997
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Linear arc discharge source for large area plasma processing
Part of Appl Phys Lett, p. 577-579, 1997
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Preferential Sputtering Effects in the Deposition of TiAl Films by Filtered Cathodic Arc Deposition
Part of Nucl Instr Phys Res B, p. 207-209, 1997
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The influence of the deposition angle on the composition of reactively sputtered thin films
Part of SURFACE & COATINGS TECHNOLOGY, p. 242-246, 1997
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Thin film processing by the radio frequency hollow cathodes
Part of SURFACE & COATINGS TECHNOLOGY, p. 723-728, 1997
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Diamond deposition in a microwave electrode discharge at reduced pressures
Part of DIAMOND AND RELATED MATERIALS, p. 224-229, 1997
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Discharge disruptions in a helicon plasma source
Part of J Vac Sci Technol A, p. 2864-2874, 1997
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Characterization of the linear arc discharge (LAD) source for film deposition
Part of SURFACE & COATINGS TECHNOLOGY, p. 578-582, 1997
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Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 145-148, 1997
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A Method for the Determination of the Angular Dependence during Dry Etching
Part of Journal of Vacuum Science & Technology B, p. 3239, 1996
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The radio frequency hollow cathode plasma jet arc for the film deposition
Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 3033-3038, 1996
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Microwave surfatron system for plasma processing
Part of JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, p. 474-477, 1996
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Linear arc discharge (LAD): A new type of hollow cathode plasma source
Part of SURFACE & COATINGS TECHNOLOGY, p. 377-380, 1996
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Resputtering effects during ion beam assisted deposition and the sputter yield amplification effect
Part of Surface & Coatings Technology, p. 353-362, 1996
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Synergistic sputtering effects during ion bombardment with two ion species
Part of J Vac Sci Technol, p. 831-833, 1995
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Controlled topography production - True 3D simulation and experiment
Part of Vacuum, p. 971-975, 1995
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Modeling of Mass Transport and Gas Kinetics of the Reactive Sputtering Process
Part of Journal de Physique IV, Colloque C5, suppl au de Jorurnal de Physique II, 5, 1995
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A new method for film deposition in the discharge of target metal vapour
Part of Surface and Coatings Technology, p. 174-180, 1995
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Metastable assisted deposition of TiN films
Part of Appl Phys Lett, p. 1521-1523, 1995
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Abnormal High Rate Deposition of TiN Films by the Radio Frequency Plasma Jet System
Part of J Electrochem Soc, p. 883-887, 1995
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Titanium nitride deposited by high rate rf hollow cathode plasma jet reactive process
Part of VACUUM, p. 1433-1438, 1995
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Hysteresis effects in the sputtering process using two reactive gases
Part of Thin Solid Films, p. 181-186, 1995
Articles, review/survey
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Upgrading the “Berg-model” for reactive sputtering processes
Part of Thin Solid Films, p. 186-192, 2014
Conference papers
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Applying "the upgraded Berg model" to predict hysteresis free reactive sputtering
p. 34-38, 2016
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High rate reactive magnetron sputtering of oxides using sputtering yield amplification
2012
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Sputter Yield Amplification of reactively sputtered TiO2
2011
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Serial magnetron co-sputtering: Sputtering yield amplification and process modelling
Part of E-MRS 2011 Spring Meeting, 2011
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Molecular dynamics simulations of low energy Ar sputtering of TiO2 surfaces
2010
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Studies of TiN films deposited by HIPIMS at different substrate temperatures and substrate bias
2010
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The influence of total processing pressure on the hysteresis behaviour in reactive sputtering
2010
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Sputtering yield amplification in reactive sputtering
2010
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Studies of hysteresis effect in reactive HiPIMS deposition of oxides
2010
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Sputtering Yield Amplification in Reactive Serial Co-Sputtering
2010
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Part of Presented at the International Symposium on Reactive Sputter Deposition (RSD2009), Manchester, United Kingdom, December 10-11, 2009, 2009
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2009
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Studies and Modelling of Surface Modifications of Different Oxides During Ion Bombardmen
Part of Presented at the 7th Asian-European International Conference on Plasma Surface Engineering (AEPSE 2009), Busan, South Korea, September 20-25, 2009, 2009
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Experiments and modelling of reactive sputtering using two reactive gases and two targets
2007
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On the high rate reactive sputtering of substoichiometric titanium oxide targets
2007
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Novel Silicon-on-SiC Substrate with Superior Thermal and RF Performance
Part of Proceedings IEEE SOI conference, p. 115-116, 2007
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A model of DC reactive magnetron sputtering for graded solar thermal absorbers
2007
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Advanced Process Modelling of the Rotating Magnetron
2006
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Dynamic Modelling of Reactive Magnetron Sputtering
2006
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Modelling of Magnetron Sputtering of Tungsten Oxide with Reactive Gas Pulsing
2006
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State of the art in Reactive Magnetron Sputtering
Part of Invited to The third Mikkeli International Industrial Coating Seminar, MIICS 2006, Mikkeli, Finland, March 16-18, 2006 and Conference Proceedings, 2006
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Experimental Studies of the Dynamic Behavior of the Reactive Sputtering Process
Part of Presented at the 5th Asian-European Int. Conf. on Plasma Surface Engineering (AEPSE 2005) in Qingdao City, China, 12-16 September, 2005
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Reactive Sputtering – Experiments and Modelling
Part of Invited to Sweden-China Symposium on Materials Science in Beijing, China, 10-13 May, 2005
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Ionenimplantation beim reaktiven Sputtern
Part of Presented at the 69. Annual Meeting of the Deutsche Physikalische Gesellschaft in Berlin, March, 2005
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Kinetic behaviour of target poisoning during reactive sputtering
Part of Reactive Sputter Deposition 2005 in Delft, The Netherlands, 2005
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Dynamic Behaviour of the Reactive Sputtering Process
Part of Presented at 13th International Congress on Thin Films 8th International Conference on Atomically Controlled Surfaces, Interfaces & Nanostructures (ICTF13/ACSIN8) in Stockholm, Sweden, 19-23 June 2005, 2005
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Modelling of Sputter Erosion Rate Enchancement from Ceramic Targets
Part of Proc of the 48th Annual Society of Vacuum Coaters Technical Conference in Denver, USA, p. 298-301, 2005
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Modelling of the Plasma Impedance in Reactive Magnetron Sputtering for Various Traget Materials
Part of Proceedings of the 48th Annual Society of Vacuum Coaters Technical Conference in Denver, April 23-28, p. 298-301, 2005
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Ion Implantation Effects in Reactive Sputter Deposition
Part of Presented at the 14th Int. Conf. on Surface Modification of Materials by Ion Beams (SMMIB’05) in Kusadasi, Turkey, 4-9 September, 2005
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Modelling of Sputter Erosion Rate Enhancement from Ceramic Targets
Part of Proceedings of Society of Vacuum Coaters, p. 324.328, 2004
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A Simplified Treatment of Target Implantation Effects in Reactive Sputtering
Part of The International Conference on Metallurgical Coatings and Thin Films in San Diego, USA, 2004
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Advances in Heuristic and Monte-Carlo Simulation of Reactive Sputtering and Technical Application
Part of Invited to the Symposium on Reactive Sputter Processes and Related Phenomena III, Ghent, Belgium, December 9-10, 2004
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Complex Target Poisoning Effects in Reactive Sputtering
Part of American Vacuum Society Symposium & Exhibition, Anaheim USA, 2004
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Influence of rotating magnets on hysteresis in reactive sputtering
Part of Society of Vacuum Coaters, 7th Annual Technical Conference Proceedings, April, 2004
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Heuristic model of the plasma impedance in reactive magnetron sputtering
Part of 5th International Conference on Coatings on Glass, Saarbrücken, Germany, July, 2004
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TRIDYN simulation of target poisoning in reactive sputtering
Part of COSIRES, Finland, 2004
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Basic Understanding of Reactive Sputtering Processes
Part of Invited to the AVS 50th National Symposium in Baltimore, Maryland, USA, November 2-7, 2003, 2003
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Basic Understanding of the Pulsed DC Reactive Spitter Deposition Process
Part of The 4th Asian-European Int Conf on Plasma Surface Engineering, AEPSE 2003, Jeju City, South Korea, September 28-October 2, 2003, 2003
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Control of reactive sputtering process using two reactive gases
Part of Proc. of the AVS 4th International Conference on Microelectronics & Interfaces, Santa Clara, USA, p. 98-103, 2003
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Stable Reactive Sputtering Processes
Part of ISSP 2003, The 7th International Symposium on Sputtering & Plasma Processes, June 11-13, Kanazawa, Japan, p. 235-239, 2003
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Stable reactive sputtering using 2 reactive gases
Part of ICMCTF 2003, The International Conference on Metallurgical Coatings and Thin Films April 28 - May 2, San Diego, USA, 2003
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Integrated capacitors using reactive DC magnetron Co-sputtered (Ta2O5)1-x(TiO2)x thin films
Part of The AVS 2nd International Conference on Microelectronics & Interfaces, Santa Clara, USA, 2001
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Part of American Vacuum Society 47th National Symposium 2000 Boston, USA, 2000
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Basic Understanding of the Pulsed DC Reactive Sputter Deposition Process
Part of Invited to Second Asian-European Int Conf on Plasma Surface Engineering (AEPSE´99), Beijing, September 15-19, 1999
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Ion assisted deposition of Zn-Mg coatings by unbalanced magnetron sputtering
Part of Proc of the 6th Int Conf on Plasma Surface Engineering, Garmisch-Partenkirchen, Germany, 1998
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Target Compound Layer Formation during Reactive Sputtering
Part of Presented at AVS 45th National Symposium in Baltimore, Maryland, USA, November 2-6, 1998
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Part of Proceedings of the 41st Annual Tech.Conf. of the Society of Vacuum Coaters (SVC), Boston 1998, ISSN 0737-5921, Paper P-1, Proc., p. 315-320, 1998
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Angular dependence of the polysilicon etch rate during dry etching in SF6 and Cl2
Part of The 43rd International Symposium of the American Vacuum Society, Philadelphia PA, USA, 1997
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Characterization and optimization of a dry etching process for silicon nitride spacer formation
Part of The 44th international symposium of the American Vacuum Society, San José, USA, 1997
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A new self aligned asymmetric lateral bipolar transistor
Part of The 17th Nordic Semiconductor Meeting, Norway, June, 1996
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A method for the determination of the angular dependence during dry etching
Part of The American Vacuum Society, 42nd National Symposium, Minneapolis, USA, Oct, 1995
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Microwave surfatron system for diamond film depositions
Part of International Symposium on Plasma Chemistry – ISPC 12, Minneapolis, USA, August 21-25, Paper no PK 1, 1995
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Part of The 42nd international symposium of the American Vacuum Society, San José, USA, 1995