Thin Film Technology I
Syllabus, Master's level, 1TE016
- Code
- 1TE016
- Education cycle
- Second cycle
- Main field(s) of study and in-depth level
- Chemistry A1F, Materials Engineering A1F, Physics A1F, Technology A1F
- Grading system
- Pass with distinction (5), Pass with credit (4), Pass (3), Fail (U)
- Finalised by
- The Faculty Board of Science and Technology, 18 April 2016
- Responsible department
- Department of Materials Science and Engineering
Entry requirements
130 credits in science/engineering. Materials Analysis should have been attended.
Learning outcomes
After a successfully completed course the students will be able to:
- discuss the differences and similarities between different vacuum based deposition techniques,
- evaluate and use models for nucleating and growth of thin films,
- asses the relation between deposition technique, film structure, and film properties,
- discuss typical thin film applications,
- motivate selection of deposition techniques for various applications.
Content
Deposition by various PVD techniques such as evaporation, sputtering, ion-plating as well as chemical coating methods (CVD and ALD). Plasma technologies for thin films. Fundamental physical and chemical processes. Effect of the substrate on the film growth and techniques for surface modification. Models for nucleation and film growth. Morphology and texture and their impact on material properties. Applications of thin film materials and deposition technologies.
Instruction
Lectures, seminars and demonstrations.
Assessment
Written examination (4 credits). Laboratory demonstrations (1 credit).
Reading list
- Reading list valid from Autumn 2023, version 2
- Reading list valid from Autumn 2023, version 1
- Reading list valid from Autumn 2022
- Reading list valid from Spring 2020
- Reading list valid from Autumn 2019
- Reading list valid from Spring 2016
- Reading list valid from Autumn 2013
- Reading list valid from Autumn 2011
- Reading list valid from Autumn 2010