Örjan Vallin
Forskare vid Institutionen för materialvetenskap; Myfab Uppsala (MSL)
- Telefon:
- 018-471 72 54
- Mobiltelefon:
- 070-167 93 48
- E-post:
- orjan.vallin@angstrom.uu.se
- Besöksadress:
- Ångströmlaboratoriet, Regementsvägen 10
- Postadress:
- Box 35
751 03 UPPSALA

Publikationer
Senaste publikationer
Ultralow magnetostrictive flexible ferromagnetic nanowires dagger
Ingår i Nanoscale, s. 6043-6052, 2021
- DOI för Ultralow magnetostrictive flexible ferromagnetic nanowires dagger
- Ladda ner fulltext (pdf) av Ultralow magnetostrictive flexible ferromagnetic nanowires dagger
Ingår i ACS Applied Materials and Interfaces, s. 37490-37499, 2021
- DOI för Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics
- Ladda ner fulltext (pdf) av Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics
Ingår i Journal of Applied Physics, 2020
- DOI för High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals
- Ladda ner fulltext (pdf) av High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals
Two-Dimensional Flexible High Diffusive Spin Circuits
Ingår i Nano Letters, s. 666-673, 2019
Ingår i Nano Energy, s. 89-94, 2018
Alla publikationer
Artiklar i tidskrift
Ultralow magnetostrictive flexible ferromagnetic nanowires dagger
Ingår i Nanoscale, s. 6043-6052, 2021
- DOI för Ultralow magnetostrictive flexible ferromagnetic nanowires dagger
- Ladda ner fulltext (pdf) av Ultralow magnetostrictive flexible ferromagnetic nanowires dagger
Ingår i ACS Applied Materials and Interfaces, s. 37490-37499, 2021
- DOI för Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics
- Ladda ner fulltext (pdf) av Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics
Ingår i Journal of Applied Physics, 2020
- DOI för High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals
- Ladda ner fulltext (pdf) av High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals
Two-Dimensional Flexible High Diffusive Spin Circuits
Ingår i Nano Letters, s. 666-673, 2019
Ingår i Nano Energy, s. 89-94, 2018
Inversion in Metal–Oxide–Semiconductor Capacitors on Boron-Doped Diamond
Ingår i IEEE Electron Device Letters, s. 603-605, 2015
Thermal characterization of polycrystalline SiC
Ingår i Journal of Electronic Materials, s. 1150-1153, 2014
Ingår i Journal of Electronic Materials, s. 541-547, 2014
Electrical properties of Ag/Ta and Ag/TaN thin-films
Ingår i Microelectronic Engineering, s. 257-261, 2014
- DOI för Electrical properties of Ag/Ta and Ag/TaN thin-films
- Ladda ner fulltext (pdf) av Electrical properties of Ag/Ta and Ag/TaN thin-films
Morphological instability of Ag films caused by phase transition in the underlying Ta barrier layer
Ingår i Applied Physics Letters, 2014
Ingår i Solid-State Electronics, s. 14-19, 2012
Fabrication and Characterization of 150 mm Silicon-on-polycrystalline-Silicon Carbide Substrates
Ingår i Journal of Electronic Materials, s. 480-487, 2012
Oxygen out-diffusion from buried layers in SOI and SiC-SOI substrates
Ingår i Solid-State Electronics, s. 153-157, 2010
Oxide-Free Silicon to Silicon Carbide Heterobond
Ingår i ESC Transactions, s. 377-383, 2008
Polishing of quartz by rapid etching in ammonium bifluoride
Ingår i IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, s. 1454-1462, 2007
Adhension quantification methods for wafer bonding
Ingår i Materials Science and Engineering, s. 109-165, 2005
Silicon fusion bond interfaces resilient to wet anisotropic etchants
Ingår i Journal of Micromechanics and Microengineering, s. 359-363, 2001
Ingår i J Micromech Microeng, s. 196-199, 2000
Quartz-to-quartz direct bonding
Ingår i Journal of the Electrochemical Society, s. 1104-1105, 1999
Konferensbidrag
High-temperature behaviour of capped Ag/Ta and Ag/TaN metal stacks
s. 137-138, 2014
Thermal stability of Ag/Ta and Ag/TaN thin-films
s. 123-124, 2013
LDMOS transistors on 150 mm silicon-on-polycrystalline-silicon carbide hybrid substrates
Ingår i Proc. of EUROSOI 2011 workshop, s. 153-154, 2011
Mobility Profiles and Thermal Characterization of SOI and Si-on-SiC hybrid substrates
Ingår i 2011 IEEE International SOI Conference Proceedings, 2011
150 mm Silicon-on-polycrystalline-Silicon Carbide
Ingår i Proceedings of EUROSOI, s. 101-102, 2010
Ingår i 2010 IEEE International SOI Conference Proceedings, Oct 11-14, San Diego CA, s. 115-116, 2010
Drift in thin film SOI piezoresistors
Ingår i Proc. of EUROSOI Workshop, 2010 Jan 25-27, Grenoble, France, s. 71-72, 2010
Study of Oxygen Out-diffusion from buried oxide layers in Si/SiC hybrid- and SOI-substrates
Ingår i EUROSOI 2009 CONFERENCE PROCEEDINGS, s. 85-86, 2009
Ingår i Proceedings of IEEE SOI conference, 2009
Thermal characterization of Silicon-on-SiC substrates
Ingår i Proceedings of IEEE International SOI Conference, s. 69-70, 2008
Oxide free wafer bonding of silicon-on-silicon carbide substrates
s. 95-96, 2008
Improved Thermal Characteristics in SOI using a Buried Aluminium Nitride Insulator
Ingår i EUROSOI Workshop, s. 97-98, 2008
Silicon-on-SiC hybrid substrate with low RF-losses and improved thermal performance
Ingår i Proceedings of GHz Symposium, s. 79, 2008
Oxide-Free Silicon to Silicon Carbide Heterobond
2008
Buried aluminum nitride insulator for improving thermal conduction in SOI
Ingår i Proceedings of IEEE SOI Conference, s. 105-106, 2008
Silicon-on-SiC hybrid substrate with improved high-frequency and thermal performance
s. 51-52, 2008
Novel Silicon-on-SiC Substrate with Superior Thermal and RF Performance
Ingår i Proceedings IEEE SOI conference, s. 115-116, 2007
Buried Aluminum Nitride Insulator for SOI Substrates
Ingår i Proc. of EUROSOI Workshop, s. 67-68, 2007
Low-temperature wafer direct bonding by surface modification in vacuum
Ingår i The 16th Symposium of the Japanese Institute of Electronics, Tokyo, Japan, March 18-20, 2002
Direct bonded quartz resonators
Ingår i Proc. of the IEEE International Frequency Control Symposium, Seattle, USA, June 6-8, 2001
Direct bonding for true all quartz package and new resonator design
Ingår i Proc of the 1999 joint meeting of the European frequency and time forum and the 1999 IEEE International Frequency Control Meeting, Becanson, France, 1999
Etching through Si-Si direct bonded interfaces
Ingår i MME´97, 1997
Ingår i ECS Annual meeting, 1997