Jan Maslik

Researcher at Department of Electrical Engineering; Integrated Smart Systems Technology

E-mail:: jan.maslik@angstrom.uu.se
Visiting address:: Ångström, Lägerhyddsvägen 1
752 37 Uppsala
Postal address:: Box 65
751 03 Uppsala

Download contact information for Jan Maslik at Department of Electrical Engineering; Integrated Smart Systems Technology

Short presentation

Study of new ways of manufacturing soft electronics for wearable systems

Publications

Selection of publications

A Comparison of a Novel Stretchable Smart Patch for Measuring Runner's Step Rates with Existing Measuring Technologies

Verdel, Nina; Drobnic, Miha; Maslik, Jan; Björnander Rahimi, Klara et al.

Part of Sensors, 2022
- DOI for A Comparison of a Novel Stretchable Smart Patch for Measuring Runner's Step Rates with Existing Measuring Technologies
- Download full text (pdf) of A Comparison of a Novel Stretchable Smart Patch for Measuring Runner's Step Rates with Existing Measuring Technologies
Soft, Stretchable and Wireless Sensor Patch with Digitally Printed Liquid Metal Alloy Interconnects

Maslik, Jan; Hellman, Oskar; Wang, Bei; Gumiero, Alessandro et al.

Part of 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2022

Recent publications

Toward Feminist Ways of Sensing the Menstruating Body

Woytuk, Nadia Campo; Tuli, Anupriya; Park, Joo Young; Vidal, Laia Turmo et al.

Part of Proceedings of the 2025 CHI Conference on Human Factors in Computing Sytems, CHI 2025, 2025
- DOI for Toward Feminist Ways of Sensing the Menstruating Body
- Download full text (pdf) of Toward Feminist Ways of Sensing the Menstruating Body
Development of a Non-contact Jet Dispensing of Liquid Metals

Maslik, Jan; Martensson, Gustaf; Gumiero, Alessandro; Cometti, Elio et al.

Part of 2024 Imaps Nordic Conference on Microelectronics Packaging, NordPac, 2024
- DOI for Development of a Non-contact Jet Dispensing of Liquid Metals
Reliability and Validity of Running Step Rate Derived From a Novel Wearable Smart Patch

Verdel, Nina; Drobnič, Miha; Maslik, Jan; Gumiero, Alessandro et al.

Part of IEEE Sensors Journal, p. 14343-14351, 2024
- DOI for Reliability and Validity of Running Step Rate Derived From a Novel Wearable Smart Patch
- Download full text (pdf) of Reliability and Validity of Running Step Rate Derived From a Novel Wearable Smart Patch
Tactful Feminist Sensing: Designing for Touching Vaginal Fluids

Woytuk, Nadia Campo; Park, Joo Young; Maslik, Jan; Felice, Marianela Ciolfi et al.

Part of DESIGNING INTERACTIVE SYSTEMS CONFERENCE, DIS 2023, p. 2642-2656, 2023
- DOI for Tactful Feminist Sensing: Designing for Touching Vaginal Fluids
Supercooled Liquid Ga Stretchable Electronics

Wang, Bei; Maslik, Jan; Hellman, Oskar; Gumiero, Alessandro et al.

Part of Advanced Functional Materials, 2023
- DOI for Supercooled Liquid Ga Stretchable Electronics
- Download full text (pdf) of Supercooled Liquid Ga Stretchable Electronics

All publications

Articles in journal

Conference papers

Toward Feminist Ways of Sensing the Menstruating Body

Woytuk, Nadia Campo; Tuli, Anupriya; Park, Joo Young; Vidal, Laia Turmo et al.

Part of Proceedings of the 2025 CHI Conference on Human Factors in Computing Sytems, CHI 2025, 2025
- DOI for Toward Feminist Ways of Sensing the Menstruating Body
- Download full text (pdf) of Toward Feminist Ways of Sensing the Menstruating Body
Development of a Non-contact Jet Dispensing of Liquid Metals

Maslik, Jan; Martensson, Gustaf; Gumiero, Alessandro; Cometti, Elio et al.

Part of 2024 Imaps Nordic Conference on Microelectronics Packaging, NordPac, 2024
- DOI for Development of a Non-contact Jet Dispensing of Liquid Metals
Tactful Feminist Sensing: Designing for Touching Vaginal Fluids

Woytuk, Nadia Campo; Park, Joo Young; Maslik, Jan; Felice, Marianela Ciolfi et al.

Part of DESIGNING INTERACTIVE SYSTEMS CONFERENCE, DIS 2023, p. 2642-2656, 2023
- DOI for Tactful Feminist Sensing: Designing for Touching Vaginal Fluids
Soft, Stretchable and Wireless Sensor Patch with Digitally Printed Liquid Metal Alloy Interconnects

Maslik, Jan; Hellman, Oskar; Wang, Bei; Gumiero, Alessandro et al.

Part of 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2022