Oskar Hellman

PhD student at Department of Electrical Engineering; Integrated Smart Systems Technology

E-mail:: oskar.hellman@angstrom.uu.se
Visiting address:: Ångström, Lägerhyddsvägen 1
752 37 Uppsala
Postal address:: Box 65
751 03 Uppsala

Download contact information for Oskar Hellman at Department of Electrical Engineering; Integrated Smart Systems Technology

Publications

Recent publications

Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits

Wang, Bei; Prasad, Sonal; Hellman, Oskar; Li, Hao et al.

Part of Advanced Functional Materials, 2024
- DOI for Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits
- Download full text (pdf) of Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits
Supercooled Liquid Ga Stretchable Electronics

Wang, Bei; Maslik, Jan; Hellman, Oskar; Gumiero, Alessandro et al.

Part of Advanced Functional Materials, 2023
- DOI for Supercooled Liquid Ga Stretchable Electronics
- Download full text (pdf) of Supercooled Liquid Ga Stretchable Electronics
Soft, Stretchable and Wireless Sensor Patch with Digitally Printed Liquid Metal Alloy Interconnects

Maslik, Jan; Hellman, Oskar; Wang, Bei; Gumiero, Alessandro et al.

Part of 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2022
Hook-and-Loop Enabled Modular Soft Robotics

Xu, Jing; Hellman, Oskar; Hjort, Klas

All publications

Articles in journal

Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits

Wang, Bei; Prasad, Sonal; Hellman, Oskar; Li, Hao et al.

Part of Advanced Functional Materials, 2024
- DOI for Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits
- Download full text (pdf) of Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits
Supercooled Liquid Ga Stretchable Electronics

Wang, Bei; Maslik, Jan; Hellman, Oskar; Gumiero, Alessandro et al.

Part of Advanced Functional Materials, 2023
- DOI for Supercooled Liquid Ga Stretchable Electronics
- Download full text (pdf) of Supercooled Liquid Ga Stretchable Electronics

Conference papers

Soft, Stretchable and Wireless Sensor Patch with Digitally Printed Liquid Metal Alloy Interconnects

Maslik, Jan; Hellman, Oskar; Wang, Bei; Gumiero, Alessandro et al.

Part of 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2022

Manuscripts (preprints)

Hook-and-Loop Enabled Modular Soft Robotics

Xu, Jing; Hellman, Oskar; Hjort, Klas