Örjan Vallin

Ultralow magnetostrictive flexible ferromagnetic nanowires dagger

Muscas, Giuseppe; Jönsson, Petra E.; Serrano, Ismael G.; Vallin, Örjan et al.

Part of Nanoscale, p. 6043-6052, 2021

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Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics

Datt, Gopal; Kotnana, Ganesh; Maddu, Ramu; Vallin, Örjan et al.

Part of ACS Applied Materials and Interfaces, p. 37490-37499, 2021

• DOI for Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics
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Strength of bonded interfaces

Vallin, Örjan; Jonsson, Kerstin; Knechtel, Roy

Part of Handbook of Silicon Based MEMS Materials and Technologies, p. 823-832, Elsevier, 2020

• DOI for Strength of bonded interfaces

High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals

Pham, Ngan Hoang; Vallin, Örjan; Panda, Jaganandha; Kamalakar, M. Venkata et al.

Part of Journal of Applied Physics, 2020

• DOI for High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals
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Two-Dimensional Flexible High Diffusive Spin Circuits

Serrano, Ismael G.; Panda, Jaganandha; Denoel, Fernand; Vallin, Örjan et al.

Part of Nano Letters, p. 666-673, 2019

• DOI for Two-Dimensional Flexible High Diffusive Spin Circuits

Ultralow magnetostrictive flexible ferromagnetic nanowires dagger

Muscas, Giuseppe; Jönsson, Petra E.; Serrano, Ismael G.; Vallin, Örjan et al.

Part of Nanoscale, p. 6043-6052, 2021

• DOI for Ultralow magnetostrictive flexible ferromagnetic nanowires dagger
• Download full text (pdf) of Ultralow magnetostrictive flexible ferromagnetic nanowires dagger

Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics

Datt, Gopal; Kotnana, Ganesh; Maddu, Ramu; Vallin, Örjan et al.

Part of ACS Applied Materials and Interfaces, p. 37490-37499, 2021

• DOI for Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics
• Download full text (pdf) of Combined Bottom-Up and Top-Down Approach for Highly Ordered One-Dimensional Composite Nanostructures for Spin Insulatronics

High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals

Pham, Ngan Hoang; Vallin, Örjan; Panda, Jaganandha; Kamalakar, M. Venkata et al.

Part of Journal of Applied Physics, 2020

• DOI for High thermoelectric power factor of p-type amorphous silicon thin films dispersed with ultrafine silicon nanocrystals
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Two-Dimensional Flexible High Diffusive Spin Circuits

Serrano, Ismael G.; Panda, Jaganandha; Denoel, Fernand; Vallin, Örjan et al.

Part of Nano Letters, p. 666-673, 2019

• DOI for Two-Dimensional Flexible High Diffusive Spin Circuits

Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process

Banerjee, Debashree; Vallin, Örjan; Samani, Kabir Majid; Majee, Subimal et al.

Part of Nano Energy, p. 89-94, 2018

• DOI for Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process
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Inversion in Metal–Oxide–Semiconductor Capacitors on Boron-Doped Diamond

Kovi, Kiran Kumar; Vallin, Örjan; Majdi, Saman; Isberg, Jan

Part of IEEE Electron Device Letters, p. 603-605, 2015

• DOI for Inversion in Metal–Oxide–Semiconductor Capacitors on Boron-Doped Diamond

Thermal characterization of polycrystalline SiC

Li, Ling-Guang; Lotfi, Sara; Vallin, Örjan; Olsson, Jörgen

Part of Journal of Electronic Materials, p. 1150-1153, 2014

• DOI for Thermal characterization of polycrystalline SiC

Dynamics of SiO₂ Buried Layer Removal from Si-SiO₂-Si and Si-SiO₂-SiC Bonded Substrates by Annealing in Ar

Li, Ling-Guang; Rubino, Stefano; Vallin, Örjan; Olsson, Jörgen

Part of Journal of Electronic Materials, p. 541-547, 2014

• DOI for Dynamics of SiO₂ Buried Layer Removal from Si-SiO₂-Si and Si-SiO₂-SiC Bonded Substrates by Annealing in Ar

Electrical properties of Ag/Ta and Ag/TaN thin-films

Mardani, Shabnam; Primetzhofer, Daniel; Liljeholm, Lina; Vallin, Örjan et al.

Part of Microelectronic Engineering, p. 257-261, 2014

• DOI for Electrical properties of Ag/Ta and Ag/TaN thin-films
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Morphological instability of Ag films caused by phase transition in the underlying Ta barrier layer

Mardani, Shabnam; Vallin, Örjan; Wätjen, Jörn Timo; Norström, Hans et al.

Part of Applied Physics Letters, 2014

• DOI for Morphological instability of Ag films caused by phase transition in the underlying Ta barrier layer

Fabrication and Characterization of 150 mm Silicon-on-polycrystalline-Silicon Carbide Substrates

Lotfi, Sara; Li, Ling-Guang; Vallin, Örjan; Norström, Hans et al.

Part of Journal of Electronic Materials, p. 480-487, 2012

• DOI for Fabrication and Characterization of 150 mm Silicon-on-polycrystalline-Silicon Carbide Substrates

LDMOS-transistors on semi-insulating silicon-on-polycrystalline-silicon carbide substrates for improved RF and thermal properties

Lotfi, Sara; Li, Ling-Guang; Vallin, Örjan; Vestling, Lars et al.

Part of Solid-State Electronics, p. 14-19, 2012

• DOI for LDMOS-transistors on semi-insulating silicon-on-polycrystalline-silicon carbide substrates for improved RF and thermal properties

Oxygen out-diffusion from buried layers in SOI and SiC-SOI substrates

Li, Ling-Guang; Vallin, Örjan; Lu, Jun; Smith, Ulf et al.

Part of Solid-State Electronics, p. 153-157, 2010

• DOI for Oxygen out-diffusion from buried layers in SOI and SiC-SOI substrates

Oxide-Free Silicon to Silicon Carbide Heterobond

Li, Ling-Guang; Vallin, Örjan; Lu, Jun; Smith, Ulf et al.

Part of ESC Transactions, p. 377-383, 2008

• DOI for Oxide-Free Silicon to Silicon Carbide Heterobond

Polishing of quartz by rapid etching in ammonium bifluoride

Vallin, Örjan; Lindberg, Ulf; Danielsson, Rolf; Thornell, Greger

Part of IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, p. 1454-1462, 2007

• DOI for Polishing of quartz by rapid etching in ammonium bifluoride

Adhension quantification methods for wafer bonding

Vallin, Örjan; Jonsson, Kerstin; Lindberg, Ulf

Part of Materials Science and Engineering, p. 109-165, 2005

Silicon fusion bond interfaces resilient to wet anisotropic etchants

Köhler, Johan; Strandman, Carola; Vallin, Örjan; Hedlund, Christer et al.

Part of Journal of Micromechanics and Microengineering, p. 359-363, 2001

High-temperature piezoresistive gauge fabricated on commercially available silicon-on-insulator wafers

Vallin, Örjan; Bäcklund, Ylva

Part of J Micromech Microeng, p. 196-199, 2000

Quartz-to-quartz direct bonding

Rangsten, Pelle; Vallin, Örjan; Hermansson, Karin; Bäcklund, Ylva

Part of Journal of the Electrochemical Society, p. 1104-1105, 1999

• DOI for Quartz-to-quartz direct bonding

Strength of bonded interfaces

Vallin, Örjan; Jonsson, Kerstin; Knechtel, Roy

Part of Handbook of Silicon Based MEMS Materials and Technologies, p. 823-832, Elsevier, 2020

• DOI for Strength of bonded interfaces

High-temperature behaviour of capped Ag/Ta and Ag/TaN metal stacks

Mardani, Shabnam; Norström, Hans; Olsson, Jörgen; Vallin, Örjan et al.

p. 137-138, 2014

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Thermal stability of Ag/Ta and Ag/TaN thin-films

Mardani, Shabnam; Liljeholm, Lina; Primetzhofer, Daniel; Vallin, Örjan

p. 123-124, 2013

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LDMOS transistors on 150 mm silicon-on-polycrystalline-silicon carbide hybrid substrates

Lotfi, Sara; Vallin, Örjan; Li, Ling-Guang; Vestling, Lars et al.

Part of Proc. of EUROSOI 2011 workshop, p. 153-154, 2011

Mobility Profiles and Thermal Characterization of SOI and Si-on-SiC hybrid substrates

Lotfi, Sara; Li, Ling-Guang; Vallin, Örjan; Norström, Hans et al.

Part of 2011 IEEE International SOI Conference Proceedings, 2011

• DOI for Mobility Profiles and Thermal Characterization of SOI and Si-on-SiC hybrid substrates

150 mm Silicon-on-polycrystalline-Silicon Carbide

Vallin, Örjan; Li, Lingguang; Norström, Hans; Smith, Ulf et al.

Part of Proceedings of EUROSOI, p. 101-102, 2010

Electrical and Thermal Characterization of 150 mm Silicon–on–polycrystalline-Silicon Carbide Hybrid Substrates

Lotfi, Sara; Vallin, Örjan; Li, Ling-Guang; Vestling, Lars et al.

Part of 2010 IEEE International SOI Conference Proceedings, Oct 11-14, San Diego CA, p. 115-116, 2010

Drift in thin film SOI piezoresistors

Anderås, Emil; Vallin, Örjan; Vestling, Lars; Katardjiev, Ilia et al.

Part of Proc. of EUROSOI Workshop, 2010 Jan 25-27, Grenoble, France, p. 71-72, 2010

LDMOS transistors on Si-on-SiC hybrid substrates having crystalline or poly-crystalline SiC - Electrical and thermal characterization

Vallin, Örjan; Li, Ling-Guang; Norström, Hans; Smith, Ulf et al.

Part of Proceedings of IEEE SOI conference, 2009

Study of Oxygen Out-diffusion from buried oxide layers in Si/SiC hybrid- and SOI-substrates

Li, Lingguang; Vallin, Örjan; Lu, Jun; Smith, Ulf et al.

Part of EUROSOI 2009 CONFERENCE PROCEEDINGS, p. 85-86, 2009

Thermal characterization of Silicon-on-SiC substrates

Vallin, Örjan; Martin, David; Lu, Jun; Li, L. G. et al.

Part of Proceedings of IEEE International SOI Conference, p. 69-70, 2008

• DOI for Thermal characterization of Silicon-on-SiC substrates

Oxide free wafer bonding of silicon-on-silicon carbide substrates

Vallin, Örjan; Martin, David; Smith, Ulf; Olsson, Jörgen

p. 95-96, 2008

Improved Thermal Characteristics in SOI using a Buried Aluminium Nitride Insulator

Martin, David; Vallin, Örjan; Vestling, Lars; Katardjiev, Ilia et al.

Part of EUROSOI Workshop, p. 97-98, 2008

Silicon-on-SiC hybrid substrate with low RF-losses and improved thermal performance

Olsson, Jörgen; Vallin, Örjan; Martin, David; Vestling, Lars et al.

Part of Proceedings of GHz Symposium, p. 79, 2008

Oxide-Free Silicon to Silicon Carbide Heterobond

Li, Ling-Guang; Vallin, Örjan; Lu, Jun; Smith, Ulf et al.

2008

Silicon-on-SiC hybrid substrate with improved high-frequency and thermal performance

Olsson, Jörgen; Vallin, Örjan; Martin, David; Vestling, Lars et al.

p. 51-52, 2008

Buried aluminum nitride insulator for improving thermal conduction in SOI

Martin, David; Vallin, Örjan; Katardjiev, Ilia; Olsson, Jörgen

Part of Proceedings of IEEE SOI Conference, p. 105-106, 2008

Novel Silicon-on-SiC Substrate with Superior Thermal and RF Performance

Olsson, Jörgen; Vallin, Örjan; Sjöblom, Gustaf; Norström, Hans et al.

Part of Proceedings IEEE SOI conference, p. 115-116, 2007

Buried Aluminum Nitride Insulator for SOI Substrates

Martin, David; Vallin, Örjan; Katardjiev, Ilia; Olsson, Jörgen

Part of Proc. of EUROSOI Workshop, p. 67-68, 2007

Low-temperature wafer direct bonding by surface modification in vacuum

Takagi, H; Maeda, R; Ito, T; Suga, T et al.

Part of The 16th Symposium of the Japanese Institute of Electronics, Tokyo, Japan, March 18-20, 2002

Direct bonded quartz resonators

Vallin, Örjan; Einefors, Bo; Hedlund, Christer; Thornell, Greger

Part of Proc. of the IEEE International Frequency Control Symposium, Seattle, USA, June 6-8, 2001

Direct bonding for true all quartz package and new resonator design

Vallin, Örjan; Rangsten, Pelle

Part of Proc of the 1999 joint meeting of the European frequency and time forum and the 1999 IEEE International Frequency Control Meeting, Becanson, France, 1999

Quartz-Quartz Bonding

Rangsten, Pelle; Vallin, Örjan; Hermansson, Karin; Bäcklund, Ylva

Part of ECS Annual meeting, 1997

Etching through Si-Si direct bonded interfaces

Köhler, Johan; Vallin, Örjan; Strandman, Carola; Hedlund, Christer et al.

Part of MME´97, 1997

Micro-channel enabled operando APXPS for interfacial Si evolution

Liu, Qianhui; Wagner, Helena; King, Laura; Lindgren, Fredrik et al.

From Silicon to Quartz: Microstructure Technology Transfer for Increased Frequency Stability

Vallin, Örjan

2004